Royston Butyl Moldable Sealant C125 Tac Tape (125 Mils)

Royston Butyl Moldable Sealant (C125 Tac Tape) is a 125 mil, high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates. The use of Butyl Moldable Sealant provides a bonded protective coating with exceptional cohesive strength, flexibility and versatility. Royston Butyl Moldable Sealant requires the use of a primer before application.